분자증류기를 이용한 페놀수지의 Photolithography 특성연구

Abstract

In these days, a lot of electronic equipments are used after following the advance of Technology. The electronic equipments controlled by electric signal which passed circuits have under the micron size pattern. A fine size electronic circuit made through the photolithography process, using photoresist and UV. Photoresist classified by reaction sensitivity to the positive and negative photoresist, and have lots of grades according to basic materials and the formulation recipe. Negative photoresist usually used to the i-line and g-line photolithography process to make the micron size circuit, it is coated on the silicon wafer and UV exposed it with masks, after that developed by the alkali developer. But in the process what making the inkjet printer cartridge head, do not use phtoresist as a usual, but use photoresist as making a structure like an ink-path way. In this study, I researched about a novolak epoxy resin with bisphenol-B and 1,1-bis(p-hydroxyphenyl)cyclohexane monomers which is a binder resin for photoresist. It builds up an ink-path way of an inkjet printer cartridge head. And also, I studied a resin controlled by the physical process using short path distillation, and bisphenol-B novolak epoxy resin has lower polydispersity index and higher Mw after getting through short path distillation.