Communication — Reduction of friction force between ceria and SiO˂inf˃2˂/inf˃for low dishing in STI CMP
- Title
- Communication — Reduction of friction force between ceria and SiO˂inf˃2˂/inf˃for low dishing in STI CMP
- Author
- 송태섭
- Keywords
- CHEMICAL-MECHANICAL PLANARIZATION; SHALLOW TRENCH ISOLATION; POLY(ACRYLIC ACID); FILMS; INTEGRATION; ADSORPTION; PARTICLES
- Issue Date
- 2017-11
- Publisher
- ELECTROCHEMICAL SOC INC
- Citation
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v. 6, no. 10, page. P752-P754
- Abstract
- We investigated the effect of friction force between ceria abrasive and SiO2 film on dishing in STI CMP. The control of adsorption amount of poly acrylic acid (PAA) on ceria surface led to the reduction of the friction force during CMP. The reduced friction force by a thick surface layer on ceria resulted in the decrease of the dishing in STI structure during over-polishing process. In the patterned wafer, the dishing decreased from 976 to 594 angstrom/min at 37.5% pattern density (Si3N4/SiO2 = 30/50 mu m) as a maximum adsorption amount increased from 0.49 to 0.64 mg/m(2). (c) 2017 The Electrochemical Society. All rights reserved.
- URI
- http://jss.ecsdl.org/content/6/10/P752https://repository.hanyang.ac.kr/handle/20.500.11754/116210
- ISSN
- 2162-8769
- DOI
- 10.1149/2.0241710jss
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > ENERGY ENGINEERING(에너지공학과) > Articles
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