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dc.contributor.author정재경-
dc.date.accessioned2019-11-30T16:20:47Z-
dc.date.available2019-11-30T16:20:47Z-
dc.date.issued2017-09-
dc.identifier.citationELECTRONIC MATERIALS LETTERS, v. 13, no. 5, page. 406-411en_US
dc.identifier.issn1738-8090-
dc.identifier.issn2093-6788-
dc.identifier.urihttps://link.springer.com/article/10.1007%2Fs13391-017-1613-2-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/115577-
dc.description.abstractThis paper proposes a new defect engineering concept for low-cost In-and Ga-free zinc tin oxide (ZTO) thin-film transistors (TFTs). This concept is comprised of capping ZTO films with tantalum (Ta) and a subsequent modest thermal annealing treatment at 200 degrees C. The Ta-capped ZTO TFTs exhibited a remarkably high carrier mobility of 70.8 cm(2)/Vs, low subthreshold gate swing of 0.18 V/decade, threshold voltage of -1.3 V, and excellent I-ON/OFF ratio of 2 x 10(8). The improvement (> two-fold) in the carrier mobility compared to the uncapped ZTO TFT can be attributed to the effective reduction of the number of adverse tailing trap states, such as hydroxyl groups or oxygen interstitial defects, which stems from the scavenging effect of the Ta capping layer on the ZTO channel layer. Furthermore, the Ta-capped ZTO TFTs showed excellent positive and negative gate bias stress stabilities.en_US
dc.description.sponsorshipThis study was supported by a National Research Foundation of Korea (NRF) grant funded the Korean government (NRF-2015R1A2A2A01003848) and the industrial strategic technology development program funded by MKE/KEIT (10051403).en_US
dc.language.isoen_USen_US
dc.publisherKOREAN INST METALS MATERIALSen_US
dc.subjectzinc tin oxide (ZTO)en_US
dc.subjectmetal cappingen_US
dc.subjectmobilityen_US
dc.subjectoxygen-related defecten_US
dc.subjectthin-film transistors (TFTs)en_US
dc.titleAchieving High Carrier Mobility Exceeding 70 cm(2)/Vs in Amorphous Zinc Tin Oxide Thin-Film Transistorsen_US
dc.typeArticleen_US
dc.relation.no5-
dc.relation.volume13-
dc.identifier.doi10.1007/s13391-017-1613-2-
dc.relation.page406-411-
dc.relation.journalELECTRONIC MATERIALS LETTERS-
dc.contributor.googleauthorKim, Sang Tae-
dc.contributor.googleauthorShin, Yeonwoo-
dc.contributor.googleauthorYun, Pil Sang-
dc.contributor.googleauthorBae, Jong Uk-
dc.contributor.googleauthorChung, In Jae-
dc.contributor.googleauthorJeong, Jae Kyeong-
dc.relation.code2017007441-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ELECTRONIC ENGINEERING-
dc.identifier.pidjkjeong1-
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COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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