3차원 구조 NAND flash memory의 mechanical stress 분포 및 온도 영향성에 관한 연

Title
3차원 구조 NAND flash memory의 mechanical stress 분포 및 온도 영향성에 관한 연
Other Titles
A study of mechanical stress distribution and temperature effect in three dimensional NAND flash memory
Author
송윤흡
Issue Date
2016-06
Publisher
대한전자공학회
Citation
2016년도 대한전자공학회 하계종합학술대회, Page. 422-425
Abstract
According to Moor’s law, Scaling of NAND flash memory was continued but nowadays two dimensional structure was reached the physical limit. Consequently three dimensional structure was researched and produced. Mechanical stress occurs reliability problem and change electrical characteristics. Especially in multi-layer structure, mechanical stress is one of the most important factor that determines cell characteristics and reliability. In this paper, we investigate mechanical stress distribution and effect of annealing temperature in 3D NAND flash memory.
URI
http://www.dbpia.co.kr/Journal/ArticleDetail/NODE06724406http://repository.hanyang.ac.kr/handle/20.500.11754/71964
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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