3차원 구조 NAND flash memory의 mechanical stress 분포 및 온도 영향성에 관한 연

Abstract

According to Moor’s law, Scaling of NAND flash memory was continued but nowadays two dimensional structure was reached the physical limit. Consequently three dimensional structure was researched and produced. Mechanical stress occurs reliability problem and change electrical characteristics. Especially in multi-layer structure, mechanical stress is one of the most important factor that determines cell characteristics and reliability. In this paper, we investigate mechanical stress distribution and effect of annealing temperature in 3D NAND flash memory.