Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 송윤흡 | - |
dc.date.accessioned | 2018-06-11T05:05:52Z | - |
dc.date.available | 2018-06-11T05:05:52Z | - |
dc.date.issued | 2016-06 | - |
dc.identifier.citation | 2016년도 대한전자공학회 하계종합학술대회, Page. 422-425 | en_US |
dc.identifier.uri | http://www.dbpia.co.kr/Journal/ArticleDetail/NODE06724406 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/71964 | - |
dc.description.abstract | According to Moor’s law, Scaling of NAND flash memory was continued but nowadays two dimensional structure was reached the physical limit. Consequently three dimensional structure was researched and produced. Mechanical stress occurs reliability problem and change electrical characteristics. Especially in multi-layer structure, mechanical stress is one of the most important factor that determines cell characteristics and reliability. In this paper, we investigate mechanical stress distribution and effect of annealing temperature in 3D NAND flash memory. | en_US |
dc.description.sponsorship | This research was supported by Basic Science Research Program through the National Research Foundation of Korea(NRF) funded by the Ministry of Science, ICT and Future Planning. (NRF-2015R1A2A2A01007289). | en_US |
dc.language.iso | ko_KR | en_US |
dc.publisher | 대한전자공학회 | en_US |
dc.title | 3차원 구조 NAND flash memory의 mechanical stress 분포 및 온도 영향성에 관한 연 | en_US |
dc.title.alternative | A study of mechanical stress distribution and temperature effect in three dimensional NAND flash memory | en_US |
dc.type | Article | en_US |
dc.relation.page | 422-425 | - |
dc.relation.journal | 전자공학회지 | - |
dc.contributor.googleauthor | 남궁연 | - |
dc.contributor.googleauthor | 양형준 | - |
dc.contributor.googleauthor | 안준섭 | - |
dc.contributor.googleauthor | 송윤흡 | - |
dc.contributor.googleauthor | Namkoong, Yeon | - |
dc.contributor.googleauthor | Yang, Hyungjun | - |
dc.contributor.googleauthor | An, JunSeop | - |
dc.contributor.googleauthor | Song, Yunheub | - |
dc.relation.code | 2012220550 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DEPARTMENT OF ELECTRONIC ENGINEERING | - |
dc.identifier.pid | yhsong2008 | - |
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