Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김영호 | - |
dc.date.accessioned | 2018-03-30T06:40:35Z | - |
dc.date.available | 2018-03-30T06:40:35Z | - |
dc.date.issued | 2012-12 | - |
dc.identifier.citation | Electronic Materials and Packaging (EMAP), 2012 14th International Conference on 2012, pp.1 - 3 | en_US |
dc.identifier.issn | 1355-7599 | - |
dc.identifier.uri | http://ieeexplore.ieee.org/document/6507904/ | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/54380 | - |
dc.description.abstract | Recently, many researchers have introduced low temperature bonding technology using Anisotropic conductive film (ACF) or Nonconductive adhesive (NCA). In their studies, the bonding temperature is in the range between 150°C and 200°C. In this study, we developed a Chip-on-Flex (COF) bonding process of 100°C by using Sn-Ag bumps and nonconductive film (NCF). Sn-Ag bumps were formed by electroplating and reflowed to form dome shape. The COF bonding was performed between Sn-Ag bumps and Cu/Polyimide film substrates using a thermo-compression bonder at 100°C for 5 s. The low temperature curable NCF was applied during the bonding process. The Sn-Ag bumps were deformed and direct contact was made between Sn-Ag bumps and Cu/PI substrate during thermo-compression bonding. The initial contact resistance of all joints was less than 30 mΩ, and no COF joints failed electrically. To evaluate reliability of COF joints, Temperature & Humidity (T&H) test (85°C/85% RH) was performed for 1000 hr. The contact resistance was increased during reliability test. However, the failed joints were not observed after T&H test. The contact resistance change will be discussed in terms of microstructure change in the COF joints. | en_US |
dc.description.sponsorship | This research was supported by a grant(F0004061-2011-34) from Information Display R&D Center, one of the Knowledge Economy Frontier R&D Program funded by the Ministry of Knowledge Economy of Korean government, and this research was conducted through the practical application project of Multi-layered composite packaging program (10041083) of Korea Electronics-machinery Convergence Technology Institute, funded by the Ministry of Knowledge Economy. | en_US |
dc.language.iso | en | en_US |
dc.publisher | IEEE | en_US |
dc.title | Development of low temperature CHip-on-Flex (COF) bonding process of 100℃ | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/EMAP.2012.6507904 | - |
dc.relation.page | - | - |
dc.contributor.googleauthor | Kim, Sun-Chul | - |
dc.contributor.googleauthor | Kim, Young-Ho | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MATERIALS SCIENCE AND ENGINEERING | - |
dc.identifier.pid | kimyh | - |
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