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Showing results 1 to 20 of 71

Issue DateTitleAuthor(s)
2018-023차원 집적을 위한 수소 이온 주입 기반 웨이퍼 본딩 및 분석한훈희
2018-02A study of Li-ZnSnO and AlOx Thin Film Grown by Mist CVD for Display ApplicationKim, Dong Hyun
2019-02A Study of Plasma Dry Cleaning on the Interface Characteristics of Trench Structured MOS DeviceMyeong Gyoon Chae
2019-02A study on growth of bulk GaN single crystal by HVPE and improvement of GaN wafer yieldJae Hwa Park
2019-02A study on improvement of transmittance through optimization of Y2O3 transparent ceramic microstructure using a spark plasma sinteringCheol Woo Park
2017-08A Study on Properties Improvement of Tin Disulfide by Thermal Atomic Layer DepositionGiyul Ham
2019-02Atomic-scale simulation study on surface-dependent structural, electronic and chemical properties of nanostructuresMinyeong Je
2019-02Behavior of the sigma phase in Mn containing superaustenitic stainless steel weld metalsChangmin Lee
2019-02CHARACTERISTICS OF SILICON OXYCARBIDE THIN FILMS DEPOSITED BY ATOMIC LAYER DEPOSITION FOR LOW-K GATE SPACER김현준
2018-08CoCrFeMnNi 고엔트로피 합금이 나타내는 특이한 통전 소성에 관한 연구김우진
2018-02Critical thickness of permeation barriers made from Ozone-based atomic layer deposited Al2O3 at low temperature권세진
2018-02Deep-UV 조사법으로 제조된 자기 정렬 박막 트랜지스터의 전기적 특성에 비정질 IGZO의 밀도가 미치는 영향최소양
2019-02DENSITY CONTROL OF ZINC OXIDE NANOROD ARRAYS USING ULTRATHIN SEED LAYER BY ATOMIC LAYER DEPOSITIONMinwook Bang
2019-02DEPOSITION OF SILICON NITRIDE THIN FILM VIA REMOTE PLASMA-ENHANCED ATOMIC LAYER DEPOSITIONHAEWON CHO
2018-02Design of novel phase-change materials based on In3SbTe2 for low-power consumption and fast switching phase-change memory최민호
2019-02DUV 조사에 의한 산화물/절연체 투명 다이오드의 정류 현상김종운
2019-02Electrical property improvement by Si doping for ZrO2 Based Capacitor using Atomic layer depositionBUMSIK KIM
2019-02Engineering Synaptic Behaviors of ReRAM Device for the Hardware Neuromorphic SystemSohyeon KIM
2019-02Fan-out electronic packaging technology utilizing flip-chip self-alignmentHwan Pil PARK
2017-08Hybrid Materials and Structure with Anti-Moisture and Stress-Release for Flexible Thin Film Encapsulation최동원

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