Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김영호 | - |
dc.date.accessioned | 2017-05-25T04:18:57Z | - |
dc.date.available | 2017-05-25T04:18:57Z | - |
dc.date.issued | 2015-09 | - |
dc.identifier.citation | ORGANIC ELECTRONICS, v. 27, Page. 65-71 | en_US |
dc.identifier.issn | 1566-1199 | - |
dc.identifier.issn | 1878-5530 | - |
dc.identifier.uri | http://www.sciencedirect.com/science/article/pii/S1566119915301208 | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/27444 | - |
dc.description.abstract | Flexible polymer memory devices were fabricated based on 4,4'-(hexafluoroisopropylidene)diphthalic anhydride-4,4'-oxydianiline #6FDA-ODA# polyimide #PI#/Cu2O nanocomposite via chemical curing, heat treatment, and post-heat treatment at low temperature #˂200 degrees C#. Following the deposition of a Cu bottom electrode on a commercial PI film substrate, a PI precursor, polyamic acid #PAA# was spin-coated onto the Cu bottom electrode, and Cu was dissolved into the PM, providing Cu ions for particle formation. The 6FDA-ODA PAA Cu complex was imidized via chemical curing using acetic anhydride and triethylamine at 50 degrees C, and thermal treatment was performed at 200 degrees C in a reducing atmosphere to remove the solvent completely and precipitate Cu nanoparticles. Post-heat treatment was sequentially carried out at 150 degrees C in an oxidizing atmosphere to oxidize Cu to Cu2O. The Al top electrode was deposited onto the 6FDA-ODA PI/Cu2O nanocomposite film, and the flexible memory device with a crossbar array showed an ON/OFF ratio of similar to 10#4#, endurance of 60 cycles, retention time of 10#4# s, and device yield of 86% #31 cells out of total 36 cells# under flat and bending conditions #bending radius similar to 1.5 mm# when the electrical measurements were performed in air at room temperature. #C# 2015 Elsevier B.V. All rights reserved. | en_US |
dc.description.sponsorship | This research was supported by 21C Frontier Research & Development Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning (code #: 2011K000215). Also, special thanks to Soon-Yong Park (Research Park, LG Chem.) and Kwang-Joo Lee (R&D center, LG Chem.) who provided 6FDA-ODA FAA. | en_US |
dc.language.iso | en | en_US |
dc.publisher | ELSEVIER SCIENCE BV | en_US |
dc.subject | Polymer memory | en_US |
dc.subject | Polyimide | en_US |
dc.subject | Cu2O nanoparticles | en_US |
dc.subject | Chemical curing | en_US |
dc.subject | Post-heat treatment | en_US |
dc.title | The formation of Cu2O nanoparticles in polyimide using Cu electrodes via chemical curing, and their application in flexible polymer memory devices | en_US |
dc.type | Article | en_US |
dc.relation.volume | 27 | - |
dc.identifier.doi | 10.1016/j.orgel.2015.09.007 | - |
dc.relation.page | 65-71 | - |
dc.relation.journal | ORGANIC ELECTRONICS | - |
dc.contributor.googleauthor | Choi, Dong Joo | - |
dc.contributor.googleauthor | Kim, Jeong-Ki | - |
dc.contributor.googleauthor | Seong, Haseob | - |
dc.contributor.googleauthor | Jang, Min-Seok | - |
dc.contributor.googleauthor | Kim, Young-Ho | - |
dc.relation.code | 2015003362 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MATERIALS SCIENCE AND ENGINEERING | - |
dc.identifier.pid | kimyh | - |
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