A Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering Technique
- Title
- A Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering Technique
- Author
- 김학성
- Keywords
- flash light sintering copper nanoparticles; copper nanowires; printed' electronics; reliability of electrode
- Issue Date
- 2015-04
- Publisher
- AMER CHEMICAL SOC
- Citation
- ACS APPLIED MATERIALS & INTERFACES, v. 7, NO 10, Page. 5674-5684
- Abstract
- In this work, copper nanowires (NWs) and Cu nanoparticles (NPs) were employed to increase the reliability of a printed electrode pattern under mechanical bending fatigue. The fabricated Cu NW/NP inks with different weight fractions of Cu NWs were printed on a polyimide substrate and flash light-sintered within a few milliseconds at room temperature under ambient conditions. Then, 1000 cycles of outer and inner bending fatigue tests were performed using a lab-made fatigue tester. The flash light-sintered Cu NW/NP ink film with 5 wt % Cu NWs prepared under the flash light-sintering conditions (12.5 J center dot cm(2) irradiation energy, 10 ms pulse duration, and one pulse) showed a lower resistivity (22.77 mu O center dot cm) than those of the only Cu NPs and Cu NWs ink (94.01 mu O center dot cm and 104.15 mu O center dot cm, respectively). In addition, the resistance change (Delta R center dot R01) of the 5 wt % Cu NWs Cu NW/NP film was greatly enhanced to 4.19 compared to the 92.75 of the Cu NPs film obtained under mechanical fatigue conditions over 1000 cycles and an outer bending radius of 7 mm. These results were obtained by the densification and enhanced mechanical flexibility of flash light-sintered Cu NW/NP network, which resulted in prevention of crack initiation and propagation. To characterize the Cu NW/NP ink film, X-ray diffraction and scanning electron microscopy were used.
- URI
- http://pubs.acs.org/doi/abs/10.1021/am506765phttp://hdl.handle.net/20.500.11754/24137
- ISSN
- 1944-8244; 1944-8252
- DOI
- 10.1021/am506765p
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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