Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김학성 | - |
dc.date.accessioned | 2016-11-03T07:05:00Z | - |
dc.date.available | 2016-11-03T07:05:00Z | - |
dc.date.issued | 2015-04 | - |
dc.identifier.citation | ACS APPLIED MATERIALS & INTERFACES, v. 7, NO 10, Page. 5674-5684 | en_US |
dc.identifier.issn | 1944-8244 | - |
dc.identifier.issn | 1944-8252 | - |
dc.identifier.uri | http://pubs.acs.org/doi/abs/10.1021/am506765p | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/24137 | - |
dc.description.abstract | In this work, copper nanowires (NWs) and Cu nanoparticles (NPs) were employed to increase the reliability of a printed electrode pattern under mechanical bending fatigue. The fabricated Cu NW/NP inks with different weight fractions of Cu NWs were printed on a polyimide substrate and flash light-sintered within a few milliseconds at room temperature under ambient conditions. Then, 1000 cycles of outer and inner bending fatigue tests were performed using a lab-made fatigue tester. The flash light-sintered Cu NW/NP ink film with 5 wt % Cu NWs prepared under the flash light-sintering conditions (12.5 J center dot cm(2) irradiation energy, 10 ms pulse duration, and one pulse) showed a lower resistivity (22.77 mu O center dot cm) than those of the only Cu NPs and Cu NWs ink (94.01 mu O center dot cm and 104.15 mu O center dot cm, respectively). In addition, the resistance change (Delta R center dot R01) of the 5 wt % Cu NWs Cu NW/NP film was greatly enhanced to 4.19 compared to the 92.75 of the Cu NPs film obtained under mechanical fatigue conditions over 1000 cycles and an outer bending radius of 7 mm. These results were obtained by the densification and enhanced mechanical flexibility of flash light-sintered Cu NW/NP network, which resulted in prevention of crack initiation and propagation. To characterize the Cu NW/NP ink film, X-ray diffraction and scanning electron microscopy were used. | en_US |
dc.description.sponsorship | This research was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (2012R1A6A1029029). This work was supported by a National Research Foundation of Korea (NRF) grant funded by the Korean Government (MEST) (No. 2013M2A2A9043280). We would like to acknowledge the financial support from the R&D Convergence Program of MSIP (Ministry of Science, ICT, and Future Planning) and ISTK (Korea Research Council for Industrial Science and Technology) of the Republic of Korea (Grant B551179-13-02-05). This work was also supported by the Technology Innovation Program (or Industrial Strategic Technology Development Program, 10048913, Development of the cheap nanoink, which is sintered in the air for smart devices) funded by the Ministry of Trade, Industry, & Energy(MI, Korea). | en_US |
dc.language.iso | en | en_US |
dc.publisher | AMER CHEMICAL SOC | en_US |
dc.subject | flash light sintering copper nanoparticles | en_US |
dc.subject | copper nanowires | en_US |
dc.subject | printed' electronics | en_US |
dc.subject | reliability of electrode | en_US |
dc.title | A Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering Technique | en_US |
dc.type | Article | en_US |
dc.relation.no | 10 | - |
dc.relation.volume | 7 | - |
dc.identifier.doi | 10.1021/am506765p | - |
dc.relation.page | 5674-5684 | - |
dc.relation.journal | ACS APPLIED MATERIALS & INTERFACES | - |
dc.contributor.googleauthor | Joo, Sung-Jun | - |
dc.contributor.googleauthor | Park, Sung-Hyeon | - |
dc.contributor.googleauthor | Moon, Chang-Jin | - |
dc.contributor.googleauthor | Kim, Hak-Sung | - |
dc.relation.code | 2015001547 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | kima | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.