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Post-CMP Cleaning

Title
Post-CMP Cleaning
Author
박진구
Keywords
Double-sided scrubber and spin-rinse dryer; Hydrodynamic boundary layer; Single-wafer megasonic cleaner
Issue Date
2007-03
Publisher
John Wiley & Sons, Inc.
Citation
Microelectronic Applications of Chemical Mechanical Planarization, Page. 467-509
URI
https://onlinelibrary.wiley.com/doi/10.1002/9780470180907.ch16https://repository.hanyang.ac.kr/handle/20.500.11754/181283
DOI
10.1002/9780470180907.ch16
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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