134 0

Full metadata record

DC FieldValueLanguage
dc.contributor.author박진구-
dc.date.accessioned2023-05-24T02:17:14Z-
dc.date.available2023-05-24T02:17:14Z-
dc.date.issued2007-03-
dc.identifier.citationMicroelectronic Applications of Chemical Mechanical Planarization, Page. 467-509-
dc.identifier.urihttps://onlinelibrary.wiley.com/doi/10.1002/9780470180907.ch16en_US
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/181283-
dc.description.sponsorshipHYU acknowledges the financial support from the Ministry of Education andHuman Resources Development (MOE), the Ministry of Commerce, Industryand Energy (MOCIE), and Ministry of Labor (MOLAB) through the fosteringproject of the Lab of Excellence, post BK21 program, and Samsung Electronics Co., Ltd., Korea.-
dc.languageen-
dc.publisherJohn Wiley & Sons, Inc.-
dc.subjectDouble-sided scrubber and spin-rinse dryer-
dc.subjectHydrodynamic boundary layer-
dc.subjectSingle-wafer megasonic cleaner-
dc.titlePost-CMP Cleaning-
dc.typeArticle-
dc.identifier.doi10.1002/9780470180907.ch16-
dc.relation.page467-509-
dc.relation.journalMicroelectronic Applications of Chemical Mechanical Planarization-
dc.contributor.googleauthorPark, Jin-Goo-
dc.contributor.googleauthorBusnaina, Ahmed A.-
dc.contributor.googleauthorHong, Yi-Koan-
dc.sector.campusE-
dc.sector.daehak공학대학-
dc.sector.department재료화학공학과-
dc.identifier.pidjgpark-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE