Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2023-05-24T02:17:14Z | - |
dc.date.available | 2023-05-24T02:17:14Z | - |
dc.date.issued | 2007-03 | - |
dc.identifier.citation | Microelectronic Applications of Chemical Mechanical Planarization, Page. 467-509 | - |
dc.identifier.uri | https://onlinelibrary.wiley.com/doi/10.1002/9780470180907.ch16 | en_US |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/181283 | - |
dc.description.sponsorship | HYU acknowledges the financial support from the Ministry of Education andHuman Resources Development (MOE), the Ministry of Commerce, Industryand Energy (MOCIE), and Ministry of Labor (MOLAB) through the fosteringproject of the Lab of Excellence, post BK21 program, and Samsung Electronics Co., Ltd., Korea. | - |
dc.language | en | - |
dc.publisher | John Wiley & Sons, Inc. | - |
dc.subject | Double-sided scrubber and spin-rinse dryer | - |
dc.subject | Hydrodynamic boundary layer | - |
dc.subject | Single-wafer megasonic cleaner | - |
dc.title | Post-CMP Cleaning | - |
dc.type | Article | - |
dc.identifier.doi | 10.1002/9780470180907.ch16 | - |
dc.relation.page | 467-509 | - |
dc.relation.journal | Microelectronic Applications of Chemical Mechanical Planarization | - |
dc.contributor.googleauthor | Park, Jin-Goo | - |
dc.contributor.googleauthor | Busnaina, Ahmed A. | - |
dc.contributor.googleauthor | Hong, Yi-Koan | - |
dc.sector.campus | E | - |
dc.sector.daehak | 공학대학 | - |
dc.sector.department | 재료화학공학과 | - |
dc.identifier.pid | jgpark | - |
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