183 0

The Effect of Thermal Aging on Nano-Particle Removal

Title
The Effect of Thermal Aging on Nano-Particle Removal
Author
박진구
Keywords
Particle Defect; Wafer backside; Footprint; Thermal aging; Cleaning
Issue Date
2021-02
Publisher
Scientific.net
Citation
Solid State Phenomena, v. 314, Page. 228-233
Abstract
The adhesion behavior of thermally aged particles was studied by characterizing the footprint, which could be formed between a particle and a substrate. To understand the formation mechanism of the footprint, the effects of temperature and aging time on the particle removal were studied. Understanding the particle adhesion and removal aged at high temperatures is important to maintain the cleanness of the wafer backside where many contaminants could adhere on in various wafer process chambers.
URI
https://www.scientific.net/SSP.314.228https://repository.hanyang.ac.kr/handle/20.500.11754/171888
ISSN
1662-9779
DOI
10.4028/www.scientific.net/SSP.314.228
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE