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Communication-Synergistic Effect of Mixed Particle Size on W CMP Process: Optimization Using Experimental Design

Title
Communication-Synergistic Effect of Mixed Particle Size on W CMP Process: Optimization Using Experimental Design
Author
백운규
Keywords
CHEMICAL-MECHANICAL PLANARIZATION; ABRASIVES
Issue Date
2017-01
Publisher
ELECTROCHEMICAL SOC INC
Citation
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v. 6, no. 1, page. 42-44
Abstract
We have investigated the synergistic effect with mixing of three different-sized SiO2 abrasives (30 nm-SiO2, 70 nm-SiO2 and 200 nm-SiO2) and the correspondingWchemical mechanical planarization (CMP) performances. Wremoval rate significantly increased when the different-sized SiO2 abrasives were mixed, which is attributed to the increase in the total contact area between the abrasives and the W film. Based on the statistical model, we obtained the optimal mixing ratio (30 nm, 70 nm, 200 nm) = (0.49, 0.23, 0.28) for the highest W removal rate. These results, investigated in this study, show that the removal rate of W film can be improved via simple mixing process. (C) 2016 The Electrochemical Society. All rights reserved.
URI
http://jss.ecsdl.org/content/6/1/P42http://repository.hanyang.ac.kr/handle/20.500.11754/105849
ISSN
2162-8769
DOI
10.1149/2.0171701jss
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ENERGY ENGINEERING(에너지공학과) > Articles
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