TY - JOUR AU - 백운규 DA - 2017/01 PY - 2017 UR - http://jss.ecsdl.org/content/6/1/P42 UR - https://repository.hanyang.ac.kr/handle/20.500.11754/105849 AB - We have investigated the synergistic effect with mixing of three different-sized SiO2 abrasives (30 nm-SiO2, 70 nm-SiO2 and 200 nm-SiO2) and the correspondingWchemical mechanical planarization (CMP) performances. Wremoval rate significantly increased when the different-sized SiO2 abrasives were mixed, which is attributed to the increase in the total contact area between the abrasives and the W film. Based on the statistical model, we obtained the optimal mixing ratio (30 nm, 70 nm, 200 nm) = (0.49, 0.23, 0.28) for the highest W removal rate. These results, investigated in this study, show that the removal rate of W film can be improved via simple mixing process. (C) 2016 The Electrochemical Society. All rights reserved. PB - ELECTROCHEMICAL SOC INC KW - CHEMICAL-MECHANICAL PLANARIZATION KW - ABRASIVES TI - Communication-Synergistic Effect of Mixed Particle Size on W CMP Process: Optimization Using Experimental Design IS - 1 VL - 6 DO - 10.1149/2.0171701jss T2 - ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY ER -