Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김학성 | - |
dc.date.accessioned | 2018-05-23T04:53:13Z | - |
dc.date.available | 2018-05-23T04:53:13Z | - |
dc.date.issued | 2016-05 | - |
dc.identifier.citation | NANOTECHNOLOGY, v. 27, NO 20, Page. 1-13 | en_US |
dc.identifier.issn | 0957-4484 | - |
dc.identifier.issn | 1361-6528 | - |
dc.identifier.uri | http://iopscience.iop.org/article/10.1088/0957-4484/27/20/205704/meta | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/71469 | - |
dc.description.abstract | In this work, combined silver/copper nanoparticles were fabricated by the electrical explosion of a metal wire. In this method, a high electrical current passes through the metal wire with a high voltage. Consequently, the metal wire evaporates and metal nanoparticles are formed. The diameters of the silver and copper nanoparticles were controlled by changing the voltage conditions. The fabricated silver and copper nano-inks were printed on a flexible polyimide (PI) substrate and sintered at room temperature via a flash light process, using a xenon lamp and varying the light energy. The microstructures of the sintered silver and copper films were observed using a scanning electron microscope (SEM) and a transmission electron microscope (TEM). To investigate the crystal phases of the flash-light-sintered silver and copper films, x-ray diffraction (XRD) was performed. The absorption wavelengths of the silver and copper nanoinks were measured using ultraviolet-visible spectroscopy (UV-vis). Furthermore, the resistivity of the sintered silver and copper films was measured using the four-point probe method and an alpha step. As a result, the fabricated Cu/Ag film shows a high electrical conductivity (4.06 mu Omega cm), which is comparable to the resistivity of bulk copper (1.68 mu Omega cm). In addition, the fabricated Cu/Ag nanoparticle film shows superior oxidation stability compared to the Cu nanoparticle film. | en_US |
dc.description.sponsorship | This work was supported by the Nano-Convergence Foundation (www.nanotech2020.org) funded by the Ministry of Science, ICT and Future Planning (MSIP, Korea) and the Ministry of Trade, Industry and Energy (MOTIE, Korea) (Project Number: R201502510). This research was also supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (2012R1A6A1029029). This work was supported by the Technology Innovation Program (and the Industrial Strategic Technology Development Program, 10048913, for the development of cheap nano-ink sintered in air for smart devices) funded by the Ministry of Trade, Industry and Energy (MI, Korea). | en_US |
dc.language.iso | en | en_US |
dc.publisher | IOP PUBLISHING LTD | en_US |
dc.subject | copper and silver nano-ink | en_US |
dc.subject | wire explosion | en_US |
dc.subject | flash light sintering | en_US |
dc.subject | low porosity | en_US |
dc.subject | printed electronics | en_US |
dc.title | Electrical wire explosion process of copper/silver hybrid nano-particle ink and its sintering via flash white light to achieve high electrical conductivity | en_US |
dc.type | Article | en_US |
dc.relation.no | 20 | - |
dc.relation.volume | 27 | - |
dc.identifier.doi | 10.1088/0957-4484/27/20/205704 | - |
dc.relation.page | 1-13 | - |
dc.relation.journal | NANOTECHNOLOGY | - |
dc.contributor.googleauthor | Chung, Wan-Ho | - |
dc.contributor.googleauthor | Hwang, Yeon-Taek | - |
dc.contributor.googleauthor | Lee, Seung-Hyun | - |
dc.contributor.googleauthor | Kim, Hak-Sung | - |
dc.relation.code | 2016001290 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | kima | - |
dc.identifier.orcid | http://orcid.org/0000-0002-6076-6636 | - |
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