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dc.contributor.author최창환-
dc.date.accessioned2018-04-16T04:19:52Z-
dc.date.available2018-04-16T04:19:52Z-
dc.date.issued2012-10-
dc.identifier.citationThin Solid Films, 30 October 2012, 521, p.30-33en_US
dc.identifier.issn0040-6090-
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S0040609012003641-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/67822-
dc.description.abstractWe report the effect of consecutive electrical stress on the performance of organic field effect transistors (OFETs). Sputtered aluminum oxide (Al2O3) and hafnium oxide (HfO2) were used as gate oxide layers. After the electrical stress, the threshold voltage, which strongly depends on bulk defects, was remarkably shifted to the negative direction, while the other performance characteristics of OFETs such as on-current, transconductance and mobility, which are sensitive to interface defects, were slightly decreased. This result implies that the defects in the bulk layer are significantly affected compared to the defects in the interface layer. Thus, it is important to control the defects in the pentacene bulk layer in order to maintain the good reliabilities of pentacene devices. Those defects in HfO2 gate oxide devices were larger compared to those in Al2O3 gate oxide devices.en_US
dc.description.sponsorshipThis work was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (2011-0006268) and the Korea Research Foundation Grant funded by the Korean Government (Grant No. KRF-2006-005-J04104). Support was also provided by Hanyang University (HYU-2011-T).en_US
dc.language.isoenen_US
dc.publisherElsevier Science B.V., Amsterdam.en_US
dc.subjectOrganic field effect transistoren_US
dc.subjectElectrical stressen_US
dc.subjectHigh-k materialen_US
dc.subjectInterface defecten_US
dc.subjectBulk defecten_US
dc.titlePerformance of organic field effect transistors with high-k gate oxide after application of consecutive bias stressen_US
dc.typeArticleen_US
dc.relation.volume521-
dc.identifier.doi10.1016/j.tsf.2012.03.078-
dc.relation.page30-33-
dc.relation.journalTHIN SOLID FILMS-
dc.contributor.googleauthorLee, S.-
dc.contributor.googleauthorChoi, C.-
dc.contributor.googleauthorLee, K.-
dc.contributor.googleauthorCho, J. H.-
dc.contributor.googleauthorKo, K. Y.-
dc.contributor.googleauthorAhn, J.-
dc.relation.code2012209470-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MATERIALS SCIENCE AND ENGINEERING-
dc.identifier.pidcchoi-
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COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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