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dc.contributor.author박승권-
dc.date.accessioned2018-04-16T01:43:47Z-
dc.date.available2018-04-16T01:43:47Z-
dc.date.issued2012-10-
dc.identifier.citation2012 18th Asia-Pacific Conference on, 2012, p.572-573en_US
dc.identifier.urihttps://ieeexplore.ieee.org/abstract/document/6388259/-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/67343-
dc.description.abstractThe smart grid is added ICT (Information & Communication Technology) into the existing electrical grid to facilitate the exchange of information between the power supplier and consumer. The V2G (Vehicle to Grid) is an application of the smart grid. The EV (Electric Vehicle) is connected to the an EVSE (Electric Vehicle Supply Equipment). Communication between EV and smart grid uses V2G. The V2G uses PLC (Power Line Communication) technology. The PLC uses HPGP (Home Plug Green PHY) in order to charging an EV with EVSE. The V2G communication interface uses IP protocols at devices in the smart grid and EVs. An EV gets IPv6 address. On the other hand, the smart grid primarily uses IPv4 address. The IPv6 is not compatible with IPv4, they can't communicate. In this research, we propose a new link adaptation layer of HPGP in order to V2G communication interface.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectIP networksen_US
dc.subjectSmart gridsen_US
dc.subjectIEEE 802.3 Standardsen_US
dc.subjectEPONen_US
dc.subjectProtocolsen_US
dc.subjectGreen productsen_US
dc.subjectElectric vehiclesen_US
dc.titleLink Adaptation Layer of Home Plug Green Phy for V2G Communication Interfaceen_US
dc.typeArticleen_US
dc.relation.no1-
dc.relation.volume1-
dc.identifier.doi10.1109/APCC.2012.6388259-
dc.relation.page572-573-
dc.contributor.googleauthorPark, Cheol-soon-
dc.contributor.googleauthorLee, Eunjo-
dc.contributor.googleauthorPark, Sung-kwon-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ELECTRONIC ENGINEERING-
dc.identifier.pidsp2996-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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