Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김영호 | - |
dc.date.accessioned | 2018-04-14T11:01:34Z | - |
dc.date.available | 2018-04-14T11:01:34Z | - |
dc.date.issued | 2011-11 | - |
dc.identifier.citation | Materials Transactions, 2011, 52(11), P.2106-2110 | en_US |
dc.identifier.issn | 1345-9678 | - |
dc.identifier.issn | 1347-5320 | - |
dc.identifier.uri | https://www.jstage.jst.go.jp/article/matertrans/52/11/52_M2011207/_article | - |
dc.description.abstract | The effect of a nonconductive adhesive (NCA) on the reliability of chip-on-glass (COG) bonding was studied. Double layer bumps consisting of dome-shaped Sn on Cu columns were formed by electroplating and a reflow process, and were used for this study. COG bonding was performed between the reflowed Sn/Cu bumps on the oxidized Si wafer and an indium tin oxide/Au/Cu/Ti/glass substrate using a thermo-compression bonder. Three types of NCAs were applied during COG bonding: NCA-A with no fillers, NCA-B with fluoropolymer fillers, and NCA-C with silica fillers. Thermal cycling from -25 degrees C to 125 degrees C for 2000 cycles was performed to evaluate the effect of NCA type on the reliability of COG joints. The initial contact resistance values of the COG joints ranged from 32.2 m Omega to 39.3 m Omega. The contact resistance increased during the thermal cycling and the trend of contact resistance increment was different among three NCA types. The failure rate was the highest in NCA-C, followed by NCA-B and NCA-A in descending order. After the thermal cycling, the cross-sections of COG joints were observed with scanning electron microscopy to analyze the failure mechanism. The failures occurred primarily due to trapped fillers and NCAs at the interface between Sn/Cu bumps and the ITO substrate. [doi:10.2320/matertrans.M2011207] | en_US |
dc.description.sponsorship | This research was supported by a grant (F0004060-2010-33) from Information Display R&D Center, one of the Knowledge Economy Frontier R&D Program funded by the Ministry of Knowledge Economy of Korean government and the Korea Research Foundation grant (KRF-2006-005-J04101). | en_US |
dc.language.iso | en | en_US |
dc.publisher | Japan INST Metals | en_US |
dc.subject | tin/copper bump | en_US |
dc.subject | nonconductive adhesive | en_US |
dc.subject | chip-on-glass | en_US |
dc.title | The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps | en_US |
dc.title.alternative | Cu Bumps | en_US |
dc.type | Article | en_US |
dc.relation.no | 11 | - |
dc.relation.volume | 52 | - |
dc.identifier.doi | 10.2320/matertrans.M2011207 | - |
dc.relation.page | 2106-2110 | - |
dc.relation.journal | Materials Transactions | - |
dc.contributor.googleauthor | Kim, Byeung Gee | - |
dc.contributor.googleauthor | Kim, Sun-Chul | - |
dc.contributor.googleauthor | Dong, Wen-Guo | - |
dc.contributor.googleauthor | Kim, Young-Ho | - |
dc.relation.code | 2011206499 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MATERIALS SCIENCE AND ENGINEERING | - |
dc.identifier.pid | kimyh | - |
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