구리 나노입자의 광소결에 의한 기판의 휨 현상 저감 연구
- Title
- 구리 나노입자의 광소결에 의한 기판의 휨 현상 저감 연구
- Other Titles
- A study to reduce the substrate warpage on flash light sintering for copper nanoparticles
- Author
- 김학성
- Keywords
- 광소결; 2단계 소결 공정; 휨; 구리 나노 입자; Flash light sintering; Two-step sintering process; Warpage; Copper nanoparticles
- Issue Date
- 2014-11
- Publisher
- 대한기계학회 / The Korean Society of Mechanical Engineers
- Citation
- 대한기계학회 춘추학술대회, 2014(11), pp.562-565(4쪽)
- Abstract
- A study to reduce the substrate warpage on flash light sintering for copper nanoparticles was investigated. In order to minimize the substrate warpage, two-step flash light sintering method was performed. The flash light sintering process was divided into a preheating step and a main sintering step. To find the optimum sintering conditions of copper nanoparticles, the flash light conditions (irradiation energy, pulse number, on-time and off-time) was varied. The microstructures and transformation crystal phase of the sintered copper nanofilms were analyzed by scanning electron microscopy. In addition, the sheet resistance was measured using a four-point probe method. Also, the thickness of copper nanofilms was measured by alpha-step. From these results, it is found that the flash light sintered copper nanofilms have a low resistivity without any damage to the thin polyimide substrate.
- URI
- http://www.dbpia.co.kr/Article/NODE06069357http://hdl.handle.net/20.500.11754/56590
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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