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dc.contributor.author김동립-
dc.date.accessioned2018-03-26T05:46:06Z-
dc.date.available2018-03-26T05:46:06Z-
dc.date.issued2014-09-
dc.identifier.citationACS NANO, Vol.8 No.9 [2014], pp. 8746-8756en_US
dc.identifier.issn1936-0851-
dc.identifier.urihttp://pubs.acs.org/doi/10.1021/nn5037587-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/52386-
dc.description.abstractFabricating thin film solar cells (TFSCs) on flexible substrates will not only broaden the applications of solar cells, but also potentially reduce the installation cost. However, a critical challenge for fabricating flexible TFSCs on flexible substrates is the incompatibility issues between the thermal, mechanical, and chemical properties of these substrates and the fabrication conditions. Transfer printing methods, which use conventional substrates for the fabrication and then deliver the TFSCs onto flexible substrates, play a key role to overcome these challenges. In this review, we discuss the basic concepts and working principles of four major transfer printing methods associated with (1) transfer by sacrificial layers, (2) transfer by porous Si layer, (3) transfer by controlled crack, and (4) transfer by water-assisted thin film delamination. We also discuss the challenges and opportunities for implementing these methods for practical solar cell manufacture. Graphic Abstracten_US
dc.description.sponsorshipThis work is financially supported by the 2013 Global Research Outreach (GRO) Program (Award no.: IC2012-1318) of the Samsung Advanced Institute of Technology (SAIT) and Samsung R&D Center America, Silicon Valley (SRA-SV) under the supervision of Dr. Debasis Bera and Anthony Radspieler Jr. D.R.K. gratefully acknowledges support from Basic Science Research Program through the National Research Foundation of Korea(NRF) funded by the Ministry of Education, Science and Technology(NRF-2012R1A1A1043135) and support from the Intelligent Synthetic Biology Center of Global Frontier Project funded by the Ministry of Education, Science and Technology of Korea(NRF-2012M3A6A8054889).en_US
dc.language.isoenen_US
dc.publisherAMERICAN CHEMICAL SOCIETYen_US
dc.subjecttransfer printing methodsen_US
dc.subjectthin film solar cellsen_US
dc.subjectflexible solar cellsen_US
dc.subjectepitaxial lift-off methoden_US
dc.subjectepitaxial layer transfer methoden_US
dc.subjectcontrolled spalling methoden_US
dc.subjectpeel-and-stick methoden_US
dc.titleTransfer Printing Methods for Flexible Thin Film Solar Cells: Basic Concepts and Working Principlesen_US
dc.typeArticleen_US
dc.relation.no9-
dc.relation.volume8-
dc.identifier.doi10.1021/nn5037587-
dc.relation.page8746-8756-
dc.relation.journalACS NANO-
dc.contributor.googleauthorLee, Chi Hwan-
dc.contributor.googleauthorKim, Dong Rip-
dc.contributor.googleauthorZheng, Xiaolin-
dc.contributor.googleauthor김동립-
dc.relation.code2014023990-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MECHANICAL ENGINEERING-
dc.identifier.piddongrip-
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COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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