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COLLEGE OF ENGINEERING SCIENCES[E](공학대학)
MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)
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Results 1-6 of 6 (Search time: 0.001 seconds).
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2003-04
나노 Imprinting 을 위한 몰드 제작에 관한 연구
박진구
2003-05
Interaction Forces Between Silica Particles and Wafer Surfaces during Chemical Mechanical Planarization of Copper
박진구
2003-06
Si Wafer Surface Cleaning Using Laser-Induced Shock Wave: A New Dry Cleaning Methodology
박진구
2003-04
Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization
박진구
2003-02
Laser Shock Removal of Micro and Nanoscale Particles
박진구
2003-02
Adhesion and removal of silica and alumina slurry particles during Cu CMP process
박진구
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adhesion force
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Ceramic Grooving
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Chemical Mechanical Planarization
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Conditioning Disk
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Diamond CVD Technology
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Dosage
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Dry cleaning
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Electron beam lithography(EBL)
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Laser shock cleaning
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laser shock cleaning
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