| 2007-11 | Damage free particle removal from EUVL mask layers by high energy laser shock cleaning (LSC) | 박진구 |
| 2008-06 | Damage free particle removal from extreme ultraviolet lithography mask layers by high energy laser shock wave cleaning | 박진구 |
| 2005-06 | The Deposition and Characterization of 10nm Thick Teflon-like Anti-stiction Films for the Hot Embossing | 박진구 |
| 2006-12 | Deposition and characterization of antistiction layer for nanoimprint lithography by VSAM (Vapor Self Assembly Monolayer) | 박진구 |
| 2013-01 | Detection of Single Nucleotide Polymorphisms Using a Biosensor-Containing Titanium-Well Array | 박진구 |
| 2013-02 | Development of CO2 gas cluster cleaning method and its characterization | 박진구 |
| 2009-04 | Development of inlaid electrodes for whole column electrochemical detection in HPLC | 박진구 |
| 2009-12 | Development of large area CoNi alloy electrodeposition process for stress free electroforming mold | 박진구 |
| 2016-12 | Development of post InGaAs CMP cleaning process for sub 10nm device application | 박진구 |
| 2007-10 | Development of post Ru CMP cleaning solutions | 박진구 |
| 2015-08 | Dimensionally controlled complex 3D sub-micron pattern fabrication by single step dual diffuser lithography (DDL) | 박진구 |
| 2006-08 | Dishing and Erosion Evaluations of Tungsten CMP Slurry inthe Orbital Polishing Syste | 박진구 |
| 2008-05 | Effect of a guard-ring on the leakage current in a Si-PIN X-ray detector for a single photon counting sensor | 박진구 |
| 2010-12 | Effect of acoustic cavitation on dissolved gases and their characterization during megasonic cleaning | 박진구 |
| 2004-11 | The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal | 박진구 |
| 2012-07 | Effect of Alkaline pH on Polishing and Etching of Single and Polycrystalline Silicon | 박진구 |
| 2023-03-22 | Effect of ammonium halide salts on wet chemical nanoscale etching and polishing of InGaAs surfaces for advanced CMOS devices | 박진구 |
| 2000-01 | Effect of Chemicals and Slurry Particles on Chemical Mechamical Polishing of Polyimide | 박진구 |
| 2000-03 | Effect of chemicals and slurry particles on chemical mechanical polishing of polyimide | 박진구 |
| 2005-11 | Effect of Corrosion inhibitor, Benzotriazole(BTA), on Particle Adhesion in Cu CMP | 박진구 |
| 2008-01 | Effect of Corrosion Inhibitor, Benzotriazole, in Cu Slurry on Cu Polishing | 박진구 |
| 2006-12 | Effect of diamonds on pad recovery in oxide and metal pad conditioning process | 박진구 |
| 2010-04 | Effect of Different Deposition Mediums on the Adhesion and Removal of Particles | 박진구 |
| 2014-07 | Effect of dissolved gases in water on acoustic cavitation and bubble growth rate in 0.83 MHz megasonic of interest to wafer cleaning | 박진구 |
| 2021-02 | Effect of Dissolved Oxygen on Removal of Benzotriazole from Co during a Post-Co CMP Cleaning | 박진구 |
| 2014-12 | Effect of FOUP atmosphere control on process wafer integrity in sub20 nm device fabrication | 박진구 |
| 2013-12 | Effect of La doping of ceria abrasives for STI CMP | 박진구 |
| 2015-05 | Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation | 박진구 |
| 2008-12 | Effect of laser shock wave cleaning direction on particle removal behavior at trenchs | 박진구 |
| 2002-10 | The Effect of Mechanical Properties of Polishing Pads on Oxide CMP | 박진구 |
