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COLLEGE OF ENGINEERING[S](공과대학)
MATERIALS SCIENCE AND ENGINEERING(신소재공학부)
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2020-01
Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding
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2020-05
Effect of (Ni, Au)(3)Sn-4 growth on the thermal resistance of Au-20 wt% Sn solder/ENIG joint in flip-chip LED packages
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2020-08
Electrowetting-on-dielectric characteristics of ZnO nanorods
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