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Issue DateTitleAuthor(s)
2013-05Development of Highly Reliable Flip-chip Bonding Technology using Non-conductive Adhesives (NCAs) for 20 um Pitch Application김영호
2013-02Bandgap engineering of graphene by corrugation on lattice-mismatched MgO (111)정용재
2013-07The significance of grain boundary sliding in the superplastic Zn-22 % Al alloy processed by ECAPMegumi Kawasaki
2013-07Stability of the ultrafine-grained microstructure in silver processed by ECAP and HPTMegumi Kawasaki
2013-07Evolution of microhardness and microstructure in a cast Al-7 % Si alloy during high-pressure torsionMegumi Kawasaki
2013-07Microstructural evolution in two-phase alloys processed by high-pressure torsionMegumi Kawasaki
2013-05An Eco-friendly Cu-Zn Wetting Layer for Highly Reliable Solder Joints김영호
2013-07A comparison of microstructures and mechanical properties in a Cu-Zr alloy processed using different SPD techniquesMegumi Kawasaki
2013-07An investigation of flow patterns and hardness distributions using different anvil alignments in high-pressure torsionMegumi Kawasaki
2013-03Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders김영호
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