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COLLEGE OF ENGINEERING[S](공과대학)
MATERIALS SCIENCE AND ENGINEERING(신소재공학부)
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Issue Date
Title
Author(s)
2013-07
Effect of permanganate treatment on through mold vias for an embedded wafer level package
김영호
2013-03
Electrical characteristics of resistive switching memory with metal oxide nanoparticles on a graphene layer
김영호
2013-05
Development of Highly Reliable Flip-chip Bonding Technology using Non-conductive Adhesives (NCAs) for 20 um Pitch Application
김영호
2013-05
An Eco-friendly Cu-Zn Wetting Layer for Highly Reliable Solder Joints
김영호
2013-03
Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders
김영호
2013-05
Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA)
김영호
2013-05
The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering
김영호
2013-11
The role of ZnO-coating-layer thickness on the recombination in CdS quantum-dot-sensitized solar cells
김영호
2013-01
Adhesion Study between Electroless Seed Layers and Build-up Dielectric Film Substrates
김영호
2013-06
Interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu-xZn (x=0-35 wt%) or Cu-xZn-yNi (x=20 and 25 wt%, y=15 and 10 wt%) substrates
김영호
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