| 2012-01 | Formation of Ag Nanostrings Induced by Lyotropic Liquid Crystalline Phospholipid Multilayer | 김영호 |
| 2015-09 | The formation of Cu2O nanoparticles in polyimide using Cu electrodes via chemical curing, and their application in flexible polymer memory devices | 김영호 |
| 2011-04 | Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives | 김영호 |
| 2015-05 | Improved drop reliability of Sn-Ag-Cu solder joints by Zn addition to a Cu wetting layer | 김영호 |
| 2011-05 | Improved Light Extraction Efficiency of InGaN-Based Multi-Quantum Well Light Emitting Diodes by Using a Single Die Growth | 김영호 |
| 2015-11 | Improvement of the adhesion between polyaniline and commercial carbon paper by acid treatment and its application in supercapacitor electrodes | 김영호 |
| 2011-01 | In(2)O(3) Nanocrystal Memory with the Barrier Engineered Tunnel Layer | 김영호 |
| 2012-04 | Interface Analysis of Embedded Chip Resistor Device Package and Its Effect on Drop Shock Reliability | 김영호 |
| 2013-06 | Interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu-xZn (x=0-35 wt%) or Cu-xZn-yNi (x=20 and 25 wt%, y=15 and 10 wt%) substrates | 김영호 |
| 2012-08 | Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNi substrates | 김영호 |
| 2015-12 | Low temperature chip on film bonding technology for 20 mu m pitch applications | 김영호 |
| 2015-07 | Mechanical and electrical stability of PEDOT: PTS and Au source/drain electrodes for bottom contact OTFTs on plastic films under bending conditions | 김영호 |
| 2016-10 | A peel adhesion study of electroless Cu layers on polymer substrates | 김영호 |
| 2017-06 | Process enabling highly accurate die position for fan-out package applications | 김영호 |
| 2014-02 | Reliability of Cu to Cu joints fabricated using SnAg capping layer for 3D applications | 김영호 |
| 2011-03 | Resistance switching properties of In2O3 nanocrystals memory device with organic and inorganic hybrid structure | 김영호 |
| 2012-10 | Resistive switching effect for ZnO hybrid memory with metal-oxide nanocrystals | 김영호 |
| 2012-07 | Resistive-Switching Memory Effect of Hybrid Structures with Polyimide and SnO2 Nanocrystals | 김영호 |
| 2013-11 | The role of ZnO-coating-layer thickness on the recombination in CdS quantum-dot-sensitized solar cells | 김영호 |
| 2019-06 | Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications | 김영호 |
| 2012-04 | Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders | 김영호 |
| 2014-08 | Synthesis of Cu or Cu2O-polyimide nanocomposites using Cu powders and their optical properties | 김영호 |
| 2014-11 | Synthesis of Dual Nanoparticles Embedded in Polyimide and Their Optical Properties | 김영호 |
| 2012-05 | Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF) | 김영호 |
| 2019-09 | Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability | 김영호 |
| 2013-03 | Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders | 김영호 |
| 2011-11 | 부품내장기술을 이용한 통신기기용 패키징 소형화 기술동향 | 김영호 |
| 2012-09 | 칩내장형 PCB 공정을 위한 칩 표면처리 공정에 관한 연구 | 김영호 |
