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dc.contributor.author김동규-
dc.date.accessioned2018-03-23T01:46:32Z-
dc.date.available2018-03-23T01:46:32Z-
dc.date.issued2014-04-
dc.identifier.citationNonlinear Theory and Its Applications, IEICE. 2014, 5, 2, 101-112en_US
dc.identifier.issn2185-4106-
dc.identifier.urihttps://www.jstage.jst.go.jp/article/nolta/5/2/5_101/_article/-char/ja/-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/51018-
dc.description.abstractPUFs, that self-generate random numbers, are used in identification or authentication applications for two reasons: cost and security. Since the randomness of PUFs in individual chips may differ, PUFs in some chips may generate somewhat less than random values. Defects during manufacturing may also affect the randomness of PUFs. In either case, confidential information based on PUFs could be vulnerable to security threats. Thus, it is necessary to identify both failing chips during manufacturing and PUFs which are not sufficiently random. To test the randomness of PUFs in a chip, we have designed a dedicated random test module optimized for hardware implementation. Finally, by implementing the module in real PUFs, we verified its validity.en_US
dc.language.isoenen_US
dc.publisher一般社?法人 電子情報通信?? / The Institute of Electronics, Information and Communication Engineersen_US
dc.titleBuilt-in hardware pseudo-random test module for physical unclonable functionsen_US
dc.typeArticleen_US
dc.relation.no3-
dc.relation.volume2-
dc.identifier.doi10.1587/nolta.5.101-
dc.relation.page1101-1112-
dc.relation.journalThe Transactions of the IEICE B(電子情報通信學會論文誌B)-
dc.contributor.googleauthorLee, Jae Seong-
dc.contributor.googleauthorChoi, Piljoo-
dc.contributor.googleauthorKim, Song-Ju-
dc.contributor.googleauthorChoi, Byong-Deok-
dc.contributor.googleauthorKim, Dong Kyue-
dc.relation.code2012211704-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ELECTRONIC ENGINEERING-
dc.identifier.piddqkim-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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