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dc.contributor.author최덕균-
dc.date.accessioned2018-03-20T06:10:06Z-
dc.date.available2018-03-20T06:10:06Z-
dc.date.issued2014-03-
dc.identifier.citationJournal of electronic materials, Vol.43 No.5 [2014], pp. 1384-1388en_US
dc.identifier.issn0361-5235-
dc.identifier.urihttp://link.springer.com/article/10.1007%2Fs11664-014-3083-8-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/49609-
dc.description.abstractResistance random access memory (ReRAM) has received attention as next-generation memory because of its excellent operating properties and high density integration capability as a crossbar array. However, the application of the existing ReRAM as a crossbar array may lead to crosstalk between adjacent cells due to its symmetric I-V characteristics. In this study, the self-rectifying effect of contact between amorphous In-Ga-Zn-O (a-IGZO) and TaO (x) was examined in a Pt/a-IGZO/TaO (x) /Al2O3/W structure. The experimental results show not only self-rectifying behavior but also forming-free characteristics. During the deposition of a-IGZO on the TaO (x) , an oxygen-rich TaO (x) interfacial layer was formed. The rectifying effect was observed regardless of the interface formation and is believed to be associated with Schottky contact formation between a-IGZO and TaO (x) . The current level remained unchanged despite repeated DC sweep cycles. The low resistance state/high resistance state ratio was about 10(1) at a read voltage of -0.5 V, and the rectifying ratio was about 10(3) at +/- 2 V.en_US
dc.description.sponsorshipThis work was supported by the National Research Foundation of Korea (NRF) Grant fundedby the Korea government (MSIP) (2005-0049407, ERC Program, Center for Materials and Processes of Self-Assembly).en_US
dc.language.isoenen_US
dc.publisherSpringer Science + Business Mediaen_US
dc.subjectResistive switchingen_US
dc.subjectself-rectifyingen_US
dc.subjectcurrent hysteresisen_US
dc.subjectReRAMen_US
dc.subjectinterfaceen_US
dc.subjectamorphous In-Ga-Zn-Oen_US
dc.titleSelf-Rectifying Effect in Resistive Switching Memory Using Amorphous InGaZnOen_US
dc.typeArticleen_US
dc.relation.volume43-
dc.identifier.doi10.1007/s11664-014-3083-8-
dc.relation.page1384-1388-
dc.relation.journalJOURNAL OF ELECTRONIC MATERIALS-
dc.contributor.googleauthorLee, J. W.-
dc.contributor.googleauthorKwon, H. M.-
dc.contributor.googleauthorKim, M. H.-
dc.contributor.googleauthorLee, S. R.-
dc.contributor.googleauthorKim, Y. B.-
dc.contributor.googleauthorChoi, D. K.-
dc.contributor.googleauthor최덕균-
dc.relation.code2014033040-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MATERIALS SCIENCE AND ENGINEERING-
dc.identifier.pidduck-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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