Smart cure cycle to improve tensile load capability of the adhesively bonded joint
- Title
- Smart cure cycle to improve tensile load capability of the adhesively bonded joint
- Author
- 김학성
- Keywords
- smart cure cycle; adhesively bonded joint; thermal residual stress; interfacial wetting
- Issue Date
- 2013-08
- Publisher
- TAYLOR & FRANCIS
- Citation
- Journal of Adhesion Science & Technology, Aug 2013, 27(16), P.1739-1754. 16P.
- Abstract
- Generally, the thermal residual stress which is generated during the curing process of an adhesive significantly decreases the tensile load capability of adhesively bonded joints. In this work, a smart cure cycle with abrupt cooling and postcuring at room temperature was devised to eliminate thermal residual stress and to produce sufficient interfacial wetting. For monitoring and controlling the curing reaction, dielectrometry was used, where the dissipation factor of the adhesive joint was measured. These results showed that the tensile load capability of the adhesively bonded joint fabricated by the smart cure cycle was greatly enhanced because the thermal residual stress was reduced, and sufficient interfacial wetting between the adhesive and adherend was achieved.
- URI
- https://www.tandfonline.com/doi/abs/10.1080/01694243.2012.754317http://hdl.handle.net/20.500.11754/45543
- ISSN
- 0169-4243
- DOI
- 10.1080/01694243.2012.754317
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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