Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 장경영 | - |
dc.date.accessioned | 2018-03-12T04:23:47Z | - |
dc.date.available | 2018-03-12T04:23:47Z | - |
dc.date.issued | 2013-12 | - |
dc.identifier.citation | Advances in Materials Science and Engineering, Vol.2013, No.- [2013], p1-6 | en_US |
dc.identifier.issn | 1687-8434 | - |
dc.identifier.uri | https://www.hindawi.com/journals/amse/2013/950791/ | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/45270 | - |
dc.description.abstract | In the semiconductor industry, with increasing requirements for high performance, high capacity, high reliability, and compact components, the crack has been one of the most critical issues in accordance with the growing requirement of the wafer-thinning in recent years. Previous researchers presented the crack detection on the silicon wafers with the air-coupled ultrasonic method successfully. However, the high impedance mismatching will be the problem in the industrial field. In this paper, in order to detect the crack, we propose a laser generated Lamb wave method which is not only noncontact, but also reliable for the measurement. The laser-ultrasonic generator and the laser-interferometer are used as a transmitter and a receiver, respectively. We firstly verified the identification of S0 and A0 lamb wave modes and then conducted the crack detection under the thermoelastic regime. The experimental results showed that S0 and A0 modes of lamb wave were clearly generated and detected, and in the case of the crack detection, the estimated crack size by 6 dB drop method was almost equal to the actual crack size. So, the proposed method is expected to make it possible to detect the crack in the silicon wafer in the industrial fields. | en_US |
dc.description.sponsorship | This work was financially supported by the National Research Foundation of Korea (NRF) as a grant funded by the Korean government (NRF-2013M2A2A9043241). | en_US |
dc.language.iso | en | en_US |
dc.publisher | HINDAWI PUBLISHING CORPORATION, 410 PARK AVENUE, 15TH FLOOR, #287 PMB, NEW YORK, NY 10022 USA | en_US |
dc.subject | Materials of engineering and construction | en_US |
dc.subject | Mechanics of materials | en_US |
dc.subject | TA401-492 | en_US |
dc.subject | Physics | en_US |
dc.subject | QC1-999 | en_US |
dc.title | Crack Detection in Single-Crystalline Silicon Wafer Using Laser Generated Lamb Wave | en_US |
dc.title.alternative | 레이저 여기 램파를 이용한 단결정 실리콘 웨이퍼의 결함 검사 | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1155/2013/950791 | - |
dc.relation.page | 1-6 | - |
dc.relation.journal | ADVANCES IN MATERIALS SCIENCE AND ENGINEERING | - |
dc.contributor.googleauthor | Song, Min-Kyoo | - |
dc.contributor.googleauthor | Jhang, Kyung-Young | - |
dc.relation.code | 2013000279 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | kyjhang | - |
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