Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 송윤흡 | - |
dc.date.accessioned | 2018-03-12T02:39:38Z | - |
dc.date.available | 2018-03-12T02:39:38Z | - |
dc.date.issued | 2016-04 | - |
dc.identifier.citation | MICROMACHINES, v. 7, NO 5, Page. 1-9 | en_US |
dc.identifier.issn | 2072-666X | - |
dc.identifier.uri | http://www.mdpi.com/2072-666X/7/5/76 | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/45170 | - |
dc.description.abstract | This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5 x 5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 mu m and sensing gap of 3.2 mu m (distance between top and bottom electrodes) is observed at 2.84 MHz. The Q factor is approximately 1300 at pressure of 0.01 Pa. | en_US |
dc.description.sponsorship | Part of this work was performed in the Micro/Nanomachining Research Education Center (MNC) of Tohoku University. This work was supported by Special Coordination Funds for Promoting Science and Technology, Formation of Innovation Center for Fusion of Advanced Technologies. | en_US |
dc.language.iso | en | en_US |
dc.publisher | MDPI AG | en_US |
dc.subject | capacitive micromachined ultrasonic transducer | en_US |
dc.subject | glass reflow process | en_US |
dc.subject | anodic bonding | en_US |
dc.subject | medical imaging | en_US |
dc.subject | non-destructive measurement | en_US |
dc.subject | chemical sensing | en_US |
dc.title | Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process | en_US |
dc.type | Article | en_US |
dc.relation.no | 5 | - |
dc.relation.volume | 7 | - |
dc.identifier.doi | 10.3390/mi7050076 | - |
dc.relation.page | 1-9 | - |
dc.relation.journal | MICROMACHINES | - |
dc.contributor.googleauthor | Toan, Nguyen Van | - |
dc.contributor.googleauthor | Hahng, Shim | - |
dc.contributor.googleauthor | Song, Yunheub | - |
dc.contributor.googleauthor | Ono, Takahito | - |
dc.relation.code | 2016009938 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DEPARTMENT OF ELECTRONIC ENGINEERING | - |
dc.identifier.pid | yhsong2008 | - |
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