In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics
- Title
- In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics
- Author
- 김학성
- Keywords
- CONDUCTIVE PATTERNS; CU; SUBSTRATE; POLYMERS; TRACKS
- Issue Date
- 2012-11
- Publisher
- IOP PUBLISHING LTD
- Citation
- NANOTECHNOLOGY, 2012, 23(48), P.485205-485300
- Abstract
- In this work, a flash-light sintering process for Cu nanoinks was studied. In order to precisely monitor the milliseconds flash-light sintering process, a real-time Wheatstone bridge electrical circuit and a high-rate data acquisition system were used. The effects of several flash-light irradiation conditions (irradiation energy, pulse number, on-time, and off-time) and the effects of the amount of poly(N-vinylpyrrolidone) in the Cu nanoink on the flash-light sintering process were investigated. The microstructures of the sintered Cu films were analyzed by scanning electron microscopy. To investigate the oxidation or reduction of the oxide-covered copper nanoparticles, a crystal phase analysis using x-ray diffraction was performed. In addition, the sheet resistance of Cu film was measured using a four-point probe method. From this study, it was found that the flash-light sintered Cu nanoink films have a conductivity of 72 Omega m/sq without any damage to the polyimide substrate. Similar nanoinks are expected to be widely used in printed and flexible electronics products in the near future.
- URI
- http://iopscience.iop.org/article/10.1088/0957-4484/24/3/035202/meta
- ISSN
- 0957-4484
- DOI
- 10.1088/0957-4484/24/3/035202
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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