Soldering-based easy packaging of thin polyimide multichannel electrodes for neuro-signal recording
- Title
- Soldering-based easy packaging of thin polyimide multichannel electrodes for neuro-signal recording
- Author
- 임창환
- Keywords
- MICROELECTRODE ARRAY; EVOKED-POTENTIALS; CORTICAL CONTROL; CORTEX; FILMS; ARM
- Issue Date
- 2012-11
- Publisher
- IOP PUBLISHING LTD, TEMPLE CIRCUS, TEMPLE WAY, BRISTOL BS1 6BE, ENGLAND
- Citation
- JOURNAL OF MICROMECHANICS AND MICROENGINEERING 권: 22 호: 11
- Abstract
- We propose a novel packaging method for preparing thin polyimide (PI) multichannel microelectrodes. The electrodes were connected simply by making a via-hole at the interconnection pad of a thin PI electrode, and a nickel (Ni) ring was constructed by electroplating through the via-hole to permit stable soldering with strong adhesion to the electrode and the printed circuit board. The electroplating conditions were optimized for the construction of a well-organized Ni ring. The electrical properties of the packaged electrode were evaluated by fabricating and packaging a 40-channel thin PI electrode. Animal experiments were performed using the packaged electrode for high-resolution recording of somatosensory evoked potential from the skull of a rat. The in vivo and in vitro tests demonstrated that the packaged PI electrode may be used broadly for the continuous measurement of bio-signals or for neural prosthetics.
- URI
- http://iopscience.iop.org/article/10.1088/0960-1317/22/11/115017/metahttp://hdl.handle.net/20.500.11754/42013
- ISSN
- 0960-1317; 1361-6439
- DOI
- 10.1088/0960-1317/22/11/115017
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > ELECTRICAL AND BIOMEDICAL ENGINEERING(전기·생체공학부) > Articles
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