Effect of Pump Pulsation on Particle Contamination on Wafer Surface in Wet Cleaning System

Abstract

The effects of pumping method on wafer cleaning were investigated. Two types of pump such as diaphragms and centrifugal were used for circulation and supply of DI water for wafer cleaning in both wet bath and single wafer tool. The cleaning studies show that the pumping methods have a great influence on cleaning performance. The experimental investigations reveal that the number of added particles on the wafer during wafer cleaning is much lesser in MLC pump (non-pulsation flow) than the both diaphragm pumps (pulsation flow).