Electrical test method using high density plasmas for high-end printed circuit boards
- Title
- Electrical test method using high density plasmas for high-end printed circuit boards
- Author
- 정진욱
- Issue Date
- 2012-01
- Publisher
- AMER INST PHYSICS, 1305 WALT WHITMAN RD, STE 300, MELVILLE, NY 11747-4501 USA
- Citation
- REVIEW OF SCIENTIFIC INSTRUMENTS; JAN 2012, 83 1, 4p.
- Abstract
- A novel electrical test method that uses high-density plasmas, such as inductively coupled discharges, is proposed to detect open/short failures of high-end printed circuit boards (PCBs). The PCB is inserted into the plasma chamber with the top side facing the plasma sheath, and the bottom of the PCB is connected to the probe pin for the dc voltage bias and current measurements. A failure, including a latent open, can be precisely detected by biasing the dc voltage near the plasma potential due to the specific characteristics of the sheath formed on the PCB surface. (C) 2012 American Institute of Physics. [doi:10.1063/1.3676162]
- URI
- http://aip.scitation.org/doi/abs/10.1063/1.3676162http://hdl.handle.net/20.500.11754/37535
- ISSN
- 0034-6748
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > ELECTRICAL AND BIOMEDICAL ENGINEERING(전기·생체공학부) > Articles
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