Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 최덕균 | - |
dc.date.accessioned | 2018-02-14T05:53:36Z | - |
dc.date.available | 2018-02-14T05:53:36Z | - |
dc.date.issued | 2011-09 | - |
dc.identifier.citation | ELECTRONIC MATERIALS LETTERS, Vol.7, No.3 [2011], p271-275 | en_US |
dc.identifier.issn | 1738-8090 | - |
dc.identifier.uri | https://link.springer.com/article/10.1007%2Fs13391-011-0917-x | - |
dc.description.abstract | Thermoelectric cooling module (TEM) which is electric device has a mechanical stress because of temperature gradient in itself. It means that structure of TEM is vulnerable in an aspect of reliability but research on reliability of TEM was not performed a lot. Recently, the more the utilization of thermoelectric cooling devices grows, the more the needs for life prediction and improvement are increasing. In this paper, we investigated life distribution, shape parameter of the TEM through accelerated life test (ALT). And we discussed about how to enhance life of TEM through the Physics-of-failure. Experimental results of ALT showed that the thermoelectric cooling module follows the Weibull distribution, shape parameter of which is 3.6. The acceleration model is coffin Coffin-Manson and material constant is 1.8. | en_US |
dc.description.sponsorship | This work was supported financially by the Midium Term Strategic Technology Development Program of the Korea Ministry of Commerce, Industry and Energy. | en_US |
dc.language.iso | en | en_US |
dc.publisher | KOREAN INST METALS MATERIALS, POSCO CENTER, 4TH FL (EAST WING), 892 DAECHI-4-DONG, KANGNAM-KU, SEOUL 135-777, SOUTH KOREA | en_US |
dc.subject | thermoelectric module(TEM) | en_US |
dc.subject | accelerated life test(ALT) | en_US |
dc.subject | reliability | en_US |
dc.subject | physics-of-failure analysis | en_US |
dc.title | Prediction of Reliability on Thermoelectric Module through Accelerated Life Test and Physics-of-Failure | en_US |
dc.type | Article | en_US |
dc.relation.no | 3 | - |
dc.relation.volume | 7 | - |
dc.identifier.doi | 10.1007/s13391-011-0917-x | - |
dc.relation.page | 271-275 | - |
dc.relation.journal | ELECTRONIC MATERIALS LETTERS | - |
dc.contributor.googleauthor | Choi, Hyoung-Seuk | - |
dc.contributor.googleauthor | Seo, Won-Seon | - |
dc.contributor.googleauthor | Choi, Duck-Kyun | - |
dc.relation.code | 2011216951 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MATERIALS SCIENCE AND ENGINEERING | - |
dc.identifier.pid | duck | - |
dc.identifier.researcherID | 24752309900 | - |
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