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dc.contributor.author윤태열-
dc.date.accessioned2018-02-08T08:05:14Z-
dc.date.available2018-02-08T08:05:14Z-
dc.date.issued2011-05-
dc.identifier.citationIEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(5):731-741 May, 2011en_US
dc.identifier.issn2156-3985-
dc.identifier.issn2156-3950-
dc.identifier.urihttp://ieeexplore.ieee.org/document/5756648/-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/36327-
dc.description.abstractThis paper provides a novel modeling methodology for multilayer capacitors (MLCs) based on the coupled transmission-line theory. From an analytical solution of a single-layer capacitor, first- and second-order equivalent-circuit models for an N-layer capacitor are introduced using an infinite series approximation. The models demonstrated accurate prediction of the behavior of MLCs up to the first and second self-resonant frequencies. In addition, distributed physical parameters for the models were extracted directly from S-parameter measurements without an optimization process. High-frequency MLCs were measured up to 20 GHz using a vector network analyzer and compared with models from 1 to 47 pF.en_US
dc.language.isoenen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141 USAen_US
dc.subjectComponents, Circuits, Devices and Systemsen_US
dc.subjectEngineered Materials, Dielectrics and Plasmasen_US
dc.subjectCapacitorsen_US
dc.subjectConductorsen_US
dc.subjectSubstratesen_US
dc.subjectMathematical modelen_US
dc.subjectIntegrated circuit modelingen_US
dc.subjectElectrodesen_US
dc.subjectInductanceen_US
dc.subjectmultilayer chip capacitoren_US
dc.subjectCoupled transmission lineen_US
dc.subjectequivalent circuiten_US
dc.subjectmultilayer capacitoren_US
dc.titleEquivalent-Circuit Modeling for Multilayer Capacitors Based on Coupled Transmission-Line Theoryen_US
dc.typeArticleen_US
dc.relation.no5-
dc.relation.volume1-
dc.identifier.doi10.1109/TCPMT.2011.2115241-
dc.relation.page731-741-
dc.relation.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY-
dc.contributor.googleauthorHyuk Sun-
dc.contributor.googleauthorZhe-Jun Jin-
dc.contributor.googleauthorMyoung-Gyun Kim-
dc.contributor.googleauthorChan-Seo Park-
dc.contributor.googleauthorTae-Yeoul Yun-
dc.relation.code2012247181-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ELECTRONIC ENGINEERING-
dc.identifier.pidtaeyeoul-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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