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dc.contributor.author최창환-
dc.date.accessioned2018-02-06T04:27:05Z-
dc.date.available2018-02-06T04:27:05Z-
dc.date.issued2011-03-
dc.identifier.citationELECTROCHEMICAL AND SOLID STATE LETTERS,권: 14 호: 6 페이지: H241-H243en_US
dc.identifier.issn1099-0062-
dc.identifier.urihttp://esl.ecsdl.org/content/14/6/H241-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/35560-
dc.description.abstractWe have investigated the effects of millisecond flash annealing (ms-FLA) on the electrical properties of p-type metal-oxide-semiconductor (pMOS) devices with high-k gate dielectrics with TiN gate. Compared to conventional rapid thermal annealing (RTA), ms-FLA improves pMOS characteristics such as positive flatband voltage (V(FB)) shift along with scaled equivalent oxide thickness (EOT) and negligible gate leakage degradation, attributed to the suppressed oxygen vacancies [V(o)(2+)] generation in high-k gate dielectrics due to a shorter thermal budget. Al-containing capping layers, TiN thickness, and Si cap deposition temperatures with ms-FLA substantially affect thermally generated [V(o)(2+)], leading to different V(FB) and EOT. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3566073] All rights reserved.en_US
dc.language.isoenen_US
dc.publisherELECTROCHEMICAL SOC INC, 65 SOUTH MAIN STREET, PENNINGTON, NJ 08534 USAen_US
dc.subjectCMOSen_US
dc.titleMillisecond Flash Annealing as a Flatband Voltage Shift Enabler for p-Type Metal-Oxide-Semiconductor Devices with High-k/Metal Gateen_US
dc.typeArticleen_US
dc.relation.no6-
dc.relation.volume14-
dc.identifier.doi10.1149/1.3566073-
dc.relation.page241-243-
dc.relation.journalELECTROCHEMICAL AND SOLID STATE LETTERS-
dc.contributor.googleauthorChoi, C-
dc.contributor.googleauthorNarayanan, V-
dc.relation.code2011202779-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MATERIALS SCIENCE AND ENGINEERING-
dc.identifier.pidcchoi-
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COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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