Two-step flash light sintering process for enhanced adhesion between copper complex ion/silane ink and a flexible substrate
- Title
- Two-step flash light sintering process for enhanced adhesion between copper complex ion/silane ink and a flexible substrate
- Author
- 김학성
- Keywords
- Two-step sintering method; Flash light sintering; Copper nanoparticle; Copper precursor; Adhesion; Oxygen plasma
- Issue Date
- 2016-03
- Publisher
- ELSEVIER SCIENCE SA
- Citation
- THIN SOLID FILMS, v. 603, Page. 382-390
- Abstract
- A copper complex ion ink (including copper nanoparticles, a copper precursor and a silane coupling agent) was synthesized to enhance the adhesion between the copper pattern and a polyimide (PI) substrate. Oxygen plasma treatment was performed on the polyimide substrate to initiate a chemical reaction between the complex ion ink and the polyimide. Then, a two-step flash light sintering method (consisting of preheating and main sintering) was used to sinter the copper complex ion ink. The copper complex ion patterns were characterized as a function of the weight fraction of silane coupling agent using scanning electron microscopy (SEM), a four-point probe method and adhesion testing. In addition, a bending fatigue test was performed to evaluate the reliability of the conductive copper pattern under cyclic bending. The copper pattern fabricated with copper complex ion ink containing 3 wt% silane coupling agent exhibited the highest adhesion level (5B), the lowest resistivity (7.6 mu Omega.cm) and a low resistance change (18%) after the bending fatigue test. The two-step sintering method used to enhance the adhesion between the copper complex ion ink and polyimide substrate was also studied using X-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FT-IR). (C) 2016 Elsevier B.V. All rights reserved.
- URI
- http://www.sciencedirect.com/science/article/pii/S0040609016001322?via%3Dihubhttp://hdl.handle.net/20.500.11754/35374
- ISSN
- 0040-6090
- DOI
- 10.1016/j.tsf.2016.02.033
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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