Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 안희준 | - |
dc.date.accessioned | 2018-01-09T06:28:59Z | - |
dc.date.available | 2018-01-09T06:28:59Z | - |
dc.date.issued | 2016-03 | - |
dc.identifier.citation | THIN SOLID FILMS, v. 603, Page. 382-390 | en_US |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | http://www.sciencedirect.com/science/article/pii/S0040609016001322?via%3Dihub | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/34277 | - |
dc.description.abstract | A copper complex ion ink (including copper nanoparticles, a copper precursor and a silane coupling agent) was synthesized to enhance the adhesion between the copper pattern and a polyimide (PI) substrate. Oxygen plasma treatment was performed on the polyimide substrate to initiate a chemical reaction between the complex ion ink and the polyimide. Then, a two-step flash light sintering method (consisting of preheating and main sintering) was used to sinter the copper complex ion ink. The copper complex ion patterns were characterized as a function of the weight fraction of silane coupling agent using scanning electron microscopy (SEM), a four-point probe method and adhesion testing. In addition, a bending fatigue test was performed to evaluate the reliability of the conductive copper pattern under cyclic bending. The copper pattern fabricated with copper complex ion ink containing 3 wt% silane coupling agent exhibited the highest adhesion level (5B), the lowest resistivity (7.6 mu Omega.cm) and a low resistance change (18%) after the bending fatigue test. The two-step sintering method used to enhance the adhesion between the copper complex ion ink and polyimide substrate was also studied using X-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FT-IR). (C) 2016 Elsevier B.V. All rights reserved. | en_US |
dc.description.sponsorship | This work was supported by the National Research Foundation of Korea (NRF), funded by the Ministry of Education (2015R1D1A1A09058418). This work was supported by the Technology Innovation Program (or Industrial Strategic Technology Development Program, 10048913, development of the cheap nano-ink which is sintered in the air for smart devices) funded By the Ministry of Trade, Industry & Energy (MI, Korea). Also, this work was supported by the Nano-Convergence Foundation (www.nanotech2020.org) funded by the Ministry of Science, ICT, and Future Planning (MSIP, Korea) and the Ministry of Trade, Industry, and Energy (MOTIE, Korea) [Project Number: R201502510]. | en_US |
dc.language.iso | en | en_US |
dc.publisher | ELSEVIER SCIENCE SA | en_US |
dc.subject | Two-step sintering method | en_US |
dc.subject | Flash light sintering | en_US |
dc.subject | Copper nanoparticle | en_US |
dc.subject | Copper precursor | en_US |
dc.subject | Adhesion | en_US |
dc.subject | Oxygen plasma | en_US |
dc.title | Two-step flash light sintering process for enhanced adhesion between copper complex ion/silane ink and a flexible substrate | en_US |
dc.type | Article | en_US |
dc.relation.volume | 603 | - |
dc.identifier.doi | 10.1016/j.tsf.2016.02.033 | - |
dc.relation.page | 382-390 | - |
dc.relation.journal | THIN SOLID FILMS | - |
dc.contributor.googleauthor | Jeon, Eun-Beom | - |
dc.contributor.googleauthor | Joo, Sung-Jun | - |
dc.contributor.googleauthor | Ahn, Heejoon | - |
dc.contributor.googleauthor | Kim, Hak-Sung | - |
dc.relation.code | 2016003143 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DEPARTMENT OF ORGANIC AND NANO ENGINEERING | - |
dc.identifier.pid | ahn | - |
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