Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate
- Title
- Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate
- Author
- 윤종승
- Keywords
- ABF; Adhesion strength; Peel-off testing
- Issue Date
- 2016-02
- Publisher
- ELSEVIER SCIENCE SA
- Citation
- THIN SOLID FILMS, v. 600, Page. 90-97
- Abstract
- The effect of Ar plasma pretreatment on the adhesion of the sputter-deposited Cu/Ti film, which was used as a seed layer for subsequent electrodeposition of thick Cu film, on an Ajinomoto build-up film (ABF) was evaluated as a function of the plasma power. The Ar plasma pretreatment of the ABF (above 1.2 kW) surface resulted in three-fold increase of the peel-off strength (0.70 kN/m) compared to the untreated sample (0.23 kN/m). The Ar plasma treatment produced a nanoscale worm-like surface roughness on the ABF surface which was responsible for the improved adhesion of the Cu/Ti film. Examination of the fractured surfaces revealed that when the substrate was plasma-treated above 1.2 kW, the fracture occurred in the substrate rather than by delamination of the Cu/Ti film. In fact, the fracture of the ABF substrate, which consists of the SiO2 filler embedded in a polymer resin matrix, proceeded mainly by decohesion of the SiO2 microspheres from the polymer matrix. Hence, to further improve the adhesion of the Cu/Ti film, it is advisable to consider strengthening the interface between the SiO2 filler and the resin matrix through surface modification of the SiO2 microspheres. (C) 2016 Elsevier B.V. All rights reserved.
- URI
- http://www.sciencedirect.com/science/article/pii/S0040609016000134?via%3Dihubhttp://hdl.handle.net/20.500.11754/34038
- ISSN
- 0040-6090
- DOI
- 10.1016/j.tsf.2016.01.010
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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