Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김학성 | - |
dc.date.accessioned | 2017-04-24T07:11:31Z | - |
dc.date.available | 2017-04-24T07:11:31Z | - |
dc.date.issued | 2015-08 | - |
dc.identifier.citation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v. 25, NO 9, Page. 1-9 | en_US |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.issn | 1361-6439 | - |
dc.identifier.uri | http://iopscience.iop.org/article/10.1088/0960-1317/25/9/095007/meta | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/26909 | - |
dc.description.abstract | In this work, a terahertz time-domain spectroscopy (THz-TDS) imaging technique was used as a non-destructive inspection method for detecting voids in integrated circuit (IC) packages. Transmission and reflection modes, with an angle of incidence of 30 degrees, were used to detect voids in IC packages. The locations of the detected voids in the IC packages could be calculated by analyzing THz waveforms. Finally, voids that are positioned at the different interfaces in the IC package samples could be successfully detected and imaged. Therefore, this THz-TDS imaging technique is expected to be a promising technique for non-destructive evaluation of IC packages. | en_US |
dc.description.sponsorship | This research was supported by the National Research Foundation of Korea (NRF) funded by the Ministry of Education (Nos 2012R1A6A1029029 and was also supported by a National Research Foundation of Korea (NRF) grant funded by the Korean Government (MEST) No 2013M2A2A9043280.) | en_US |
dc.language.iso | en | en_US |
dc.publisher | IOP PUBLISHING LTD | en_US |
dc.subject | non-destructive | en_US |
dc.subject | terahertz | en_US |
dc.subject | void | en_US |
dc.subject | IC package | en_US |
dc.subject | detection | en_US |
dc.title | Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy | en_US |
dc.type | Article | en_US |
dc.relation.no | 9 | - |
dc.relation.volume | 25 | - |
dc.identifier.doi | 10.1088/0960-1317/25/9/095007 | - |
dc.relation.page | 1-9 | - |
dc.relation.journal | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.contributor.googleauthor | Park, Sung-Hyeon | - |
dc.contributor.googleauthor | Jang, Jin-Wook | - |
dc.contributor.googleauthor | Kim, Hak-Sung | - |
dc.relation.code | 2015000640 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | kima | - |
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