Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 백운규 | - |
dc.date.accessioned | 2017-02-14T01:33:24Z | - |
dc.date.available | 2017-02-14T01:33:24Z | - |
dc.date.issued | 2015-06 | - |
dc.identifier.citation | APPLIED SURFACE SCIENCE, v. 353, Page. 499-503 | en_US |
dc.identifier.issn | 0169-4332 | - |
dc.identifier.issn | 1873-5584 | - |
dc.identifier.uri | http://www.sciencedirect.com/science/article/pii/S0169433215014221 | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/25460 | - |
dc.description.abstract | Although poly(acrylic acid) (PAA) has been used as a passivation agent for high polish rate selectivity between SiO2 and Si3N4 in STI CMP, it causes severe dishing during the over-polishing step. Here, we fabricated interpolymer complexes of PAA and poly(ethylene glycol) (PEG) as passivation agent for low dishing as well as high selectivity. PAA and PEG form a cross-linked network structure through H-bonding, which is called an "interpolymer complex". During the over-polishing step, the cross-linked network structure of the PAA-PEG interpolymer complex prevents abrasives from polishing SiO2 in the trenches, resulting in a significant decrease in dishing. These results provide researchers with a new approach toward passivation agents to provide low dishing in STI CMP. (C) 2015 Elsevier B.V. All rights reserved. | en_US |
dc.description.sponsorship | This work was supported by the Global Research Laboratory (GRL) Program (K20704000003TA050000310) through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT (Information and Communication Technologies) and Future Planning. | en_US |
dc.language.iso | en | en_US |
dc.publisher | ELSEVIER SCIENCE BV | en_US |
dc.subject | Passivation agent | en_US |
dc.subject | PAA | en_US |
dc.subject | PEG | en_US |
dc.subject | Interpolymer complexes | en_US |
dc.subject | Dishing | en_US |
dc.subject | CMP | en_US |
dc.title | Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP | en_US |
dc.type | Article | en_US |
dc.relation.volume | 353 | - |
dc.identifier.doi | 10.1016/j.apsusc.2015.06.078 | - |
dc.relation.page | 499-503 | - |
dc.relation.journal | APPLIED SURFACE SCIENCE | - |
dc.contributor.googleauthor | Seo, Jihoon | - |
dc.contributor.googleauthor | Moon, Jinok | - |
dc.contributor.googleauthor | Moon, Sunho | - |
dc.contributor.googleauthor | Paik, Ungyu | - |
dc.relation.code | 2015001918 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DEPARTMENT OF ENERGY ENGINEERING | - |
dc.identifier.pid | upaik | - |
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