전기단자 돌기 성형공정의 결정소성 유한요소해석

Abstract

In this study, a bump forming process of electronic terminal was simulated by employing the finite element analysis based on crystal plasticity. In order to find the best fitted micro-material properties of the specimen, the stress-strain curves constructed by simulating the tensile test with various micro-material property set were compared with that obtained by the experiment. The height of bump was compared among crystal plastic finite element analysis, conventional macro-plastic finite element analysis and experiment. The comparison reveals that the bump forming process simulation using crystal plastic FEA can improve about 11%, compared to conventional macro-plastic FEA.