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dc.contributor.author권오경-
dc.date.accessioned2016-09-02T07:09:21Z-
dc.date.available2016-09-02T07:09:21Z-
dc.date.issued2015-03-
dc.identifier.citationIEEE TRANSACTIONS ON ELECTRON DEVICES, v. 62, NO 3, Page. 888-895en_US
dc.identifier.issn0018-9383-
dc.identifier.issn1557-9646-
dc.identifier.urihttp://ieeexplore.ieee.org/document/7006786/?arnumber=7006786-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/22980-
dc.description.abstractThis paper presents a high-speed wafer-scale CMOS X-ray detector with an active area of 12 cm x 12 cm, which features 100 mu m-sized pixels. A horizontal row driver is adopted for implementing a three-side buttable detector with the tiling technique and thereby enabling the extension of the active area. The proposed detector employs 14-b column-parallel extended-counting analog-to-digital converters (EC ADCs) using digital correlated double sampling for high-speed operation and high-gray-scale resolution. The oversampling binning method using a Delta Sigma modulator in EC ADCs is proposed for high sensitivity and the pipelined timing method is adopted for a high frame rate, which results in reduction of the X-ray dose. An offset cancellation method for the input buffer is used to improve the uniformity between column ADCs. The proposed CMOS X-ray detector is fabricated using a 0.35-mu m CMOS process with the stitching technique. The measured differential column fixed pattern noise and random noise without X-ray exposure are 3.01 and 3.06 least significant bits, respectively, at a resolution of 14 b. In the full-resolution mode, the proposed detector operates up to a frame frequency of 108 frames/s with the pipelined timing and 60 frames/s without the pipelined timing.en_US
dc.description.sponsorshipCooperative Research and Development Program Korea Research Council for Industrial Science and Technologyen_US
dc.language.isoenen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCen_US
dc.subjectCMOS X-ray detectoren_US
dc.subjectcolumn-parallel extended-counting analog-to-digital converter (EC ADC)en_US
dc.subjectoversampling binning operationen_US
dc.subjectpipelined timingen_US
dc.subjectwafer-scale sensoren_US
dc.titleA High-Speed Wafer-Scale CMOS X-Ray Detector With Column-Parallel ADCs Using Oversampling Binning Methoden_US
dc.typeArticleen_US
dc.relation.no3-
dc.relation.volume62-
dc.identifier.doi10.1109/TED.2014.2386533-
dc.relation.page888-895-
dc.relation.journalIEEE TRANSACTIONS ON ELECTRON DEVICES-
dc.contributor.googleauthorKim, Jong-Boo-
dc.contributor.googleauthorHong, Seong-Kwan-
dc.contributor.googleauthorKwon, Oh-Kyong-
dc.relation.code2015002887-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ELECTRONIC ENGINEERING-
dc.identifier.pidokwon-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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