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dc.contributor.author백상현-
dc.date.accessioned2024-04-17T02:11:14Z-
dc.date.available2024-04-17T02:11:14Z-
dc.date.issued2023-05-15-
dc.identifier.citation2023 IEEE International Reliability Physics Symposium (IRPS)en_US
dc.identifier.issn1938-1891en_US
dc.identifier.urihttps://information.hanyang.ac.kr/#/eds/detail?an=edseee.10117935&dbId=edseeeen_US
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/189824-
dc.description.abstractIn this study, a thermal neutron (TN) radiation test was conducted for DRAM devices of 1y nm technology. Accordingly, the write recovery time (tWR) degradation was observed to range from 1-ns (degradation) to more than 15 ns (failure). Specifically, permanent timing degradation is expected, owing to secondary particles generated from the interactions of 10B and TN. The samples from two manufacturers were compared and exhibited an 8.9 times maximum difference in the degradation cross-section.en_US
dc.languageen_USen_US
dc.publisherIEEEen_US
dc.relation.ispartofseries;1-6-
dc.subjectDynamic random-access memory (DRAM)en_US
dc.subjectwrite recovery timeen_US
dc.subjectthermal neutronen_US
dc.subjectdisplacement damageen_US
dc.titleWrite Recovery Time Degradation by Thermal Neutrons in DDR4 DRAM Componentsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/IRPS48203.2023.10117935en_US
dc.relation.page1-6-
dc.contributor.googleauthorOh, Hyeongseok-
dc.contributor.googleauthorChun, Myungsun-
dc.contributor.googleauthorLee, Jiwon-
dc.contributor.googleauthorWen, Shi-Jie-
dc.contributor.googleauthorYu, Nick-
dc.contributor.googleauthorPark, Byung-Gun-
dc.contributor.googleauthorBaeg, Sanghyeon-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentSCHOOL OF ELECTRICAL ENGINEERING-
dc.identifier.pidbau-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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