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Efficient diagnosis technique for aging defects on automotive semiconductor chips

Title
Efficient diagnosis technique for aging defects on automotive semiconductor chips
Author
박성주
Keywords
aging monitoring; on-line test; scan flip-flop
Issue Date
2015-05
Publisher
Institute of Electrical and Electronics Engineers Inc.
Citation
Proceedings - 2015 20th IEEE European Test Symposium, ETS 2014, article no. 7138767, Page. 1-2
Abstract
The semiconductor aging is one of the serious threats for the reliability of the system. This paper presents an efficient mechanism for predicting the aging effect. The captured data will be unloaded by shift operation, then verified through the aging monitoring operation. Especially the aging level of automotive semiconductor devices can be estimated by controlling the capture timing. Since the aging monitoring function is efficiently on and off during normal operation, power consumption can be reduced significantly compared with other approaches. © 2015 IEEE.
URI
https://ieeexplore.ieee.org/document/7138767https://repository.hanyang.ac.kr/handle/20.500.11754/185638
ISSN
1530-1877;1558-1780
DOI
10.1109/ETS.2015.7138767
Appears in Collections:
COLLEGE OF COMPUTING[E](소프트웨어융합대학) > COMPUTER SCIENCE(소프트웨어학부) > Articles
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