Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 오제훈 | - |
dc.date.accessioned | 2023-07-14T02:21:14Z | - |
dc.date.available | 2023-07-14T02:21:14Z | - |
dc.date.issued | 2007-05 | - |
dc.identifier.citation | Materials Science Forum, v. 544-545, Page. 427-430 | - |
dc.identifier.issn | 0255-5476;1662-9752 | - |
dc.identifier.uri | https://www.scientific.net/MSF.544-545.427 | en_US |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/183691 | - |
dc.description.abstract | A 3-D transient heat transfer finite element (FE) analysis was performed to simulate the curing process of thick thermoset composites. The simulated temperature was compared with the available experimental data to check the validity of the analysis. The influence of thickness of composite laminates on the temperature distribution was investigated, and how the size of laminates affects the inside temperature was also discussed. The results indicate that the laminate thickness rather than the laminate size has a significant influence on temperature distribution, and the 3-D analysis offers more accurate predictions than the 1-D analysis. | - |
dc.language | en | - |
dc.publisher | Trans Tech Publications Ltd. | - |
dc.subject | Cure simulation | - |
dc.subject | Exothermic reaction | - |
dc.subject | Temperature overshoot | - |
dc.subject | Thick composites | - |
dc.title | Prediction of temperature distribution during curing thick thermoset composite laminates | - |
dc.type | Article | - |
dc.relation.volume | 544-545 | - |
dc.identifier.doi | 10.4028/www.scientific.net/MSF.544-545.427 | - |
dc.relation.page | 427-430 | - |
dc.relation.journal | Materials Science Forum | - |
dc.contributor.googleauthor | Oh, Je Hoon | - |
dc.sector.campus | E | - |
dc.sector.daehak | 공학대학 | - |
dc.sector.department | 기계공학과 | - |
dc.identifier.pid | jehoon | - |
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