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dc.contributor.author오제훈-
dc.date.accessioned2023-07-14T02:18:14Z-
dc.date.available2023-07-14T02:18:14Z-
dc.date.issued2010-05-
dc.identifier.citationMATERIALS LETTERS, v. 64, NO. 9, Page. 1069-1072-
dc.identifier.issn0167-577X;1873-4979-
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S0167577X10001266?via%3Dihuben_US
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/183682-
dc.description.abstractWe investigated electrical properties of inkjet-printed Ag lines by varying the substrate, dimension of lines and sintering temperature. The effect of cracks developed in the lines during drying and sintering was also examined. The results show clear evidence of a strong crack and substrate effect on electrical properties of printed Ag lines. The crack formation is clearly dependent on the dimension of lines. Crack network occurs and becomes more pronounced for wider and thicker lines. Even without the crack formation, the resistance and resistivity of lines on glass are higher than those on polyimide due to residual thermal stresses. (C) 2010 Elsevier B.V. All rights reserved.-
dc.languageen-
dc.publisherELSEVIER SCIENCE BV-
dc.subjectElectrical resistivity-
dc.subjectInkjet printing-
dc.subjectNanoparticle ink-
dc.subjectCracks-
dc.subjectResidual thermal stresses-
dc.titleCrack formation and substrate effects on electrical resistivity of inkjet-printed Ag lines-
dc.typeArticle-
dc.relation.no9-
dc.relation.volume64-
dc.identifier.doi10.1016/j.matlet.2010.02.014-
dc.relation.page1069-1072-
dc.relation.journalMATERIALS LETTERS-
dc.contributor.googleauthorLee, Dong Jun-
dc.contributor.googleauthorOh, Je Hoon-
dc.contributor.googleauthorBae, Han Seung-
dc.sector.campusE-
dc.sector.daehak공학대학-
dc.sector.department기계공학과-
dc.identifier.pidjehoon-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
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